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        三招改变孩子的粗心IEEE CICC Call for Papers三招改变孩子的粗心

        三招改变孩子的粗心Extended Submission Deadline is 11:59 pm PT 三招改变孩子的粗心三招改变孩子的粗心on November 3, 2020三招改变孩子的粗心

        三招改变孩子的粗心IEEE Custom Integrated Circuits Conference 三招改变孩子的粗心三招改变孩子的粗心(三招改变孩子的粗心三招改变孩子的粗心CICC)三招改变孩子的粗心

        is sponsored by the IEEE Solid-State Circuits Society

        and technically co-sponsored by the IEEE Electron Devices Society

        三招改变孩子的粗心April 25 – April 28, 2021 in Austin, Texas三招改变孩子的粗心

        三招改变孩子的粗心Submission of original unpublished work in following areas:三招改变孩子的粗心


        三招改变孩子的粗心Analog & Digitally-Assisted Circuit Techniques三招改变孩子的粗心 and building blocks such as amplifiers, comparators, frequency generation and clocking, filters, references, and nonlinear signal processing circuits.

        三招改变孩子的粗心Data Converters 三招改变孩子的粗心including Nyquist and oversampled A/D, D/A, time-to-digital, frequency-to-digital and analog-to-information converters of all types driven by new techniques, architectures, technologies or applications.

        三招改变孩子的粗心Design Foundations 三招改变孩子的粗心for novel digital, analog, mixed-signal, and memory circuit techniques for present and emerging applications (deep learning, autonomous vehicles, IoT, security, quantum computing). Modeling and simulation of advanced and cryogenic CMOS (FinFET, UTTB-SOI), Non-volatile memories and beyond-CMOS devices (e.g. MEMS, GaN, STT) to improve design quality, efficiency, and reliability. Design for manufacturing, test, aging, security, and reliability (novel Design for Test circuits, system-level testing). High-level system modeling, digital/analog design infrastructure, and verification and emulation for complex SoCs (e.g. 2.5D and 3D SiP).

        三招改变孩子的粗心Digital Circuits, SoCs, & Systems 三招改变孩子的粗心solicits hardware papers in technologies that enhance efficiency, performance, or security of integrated systems. Areas of interest include processors, accelerators, interconnect fabrics, and memory systems, with applications in AI, autonomous transportation, low-temperature computing, quantum computing sub-systems, cloud computing, genome sequencing, sensing, edge computing, and communication.

        三招改变孩子的粗心Emerging Technologies, Systems, and Applications 三招改变孩子的粗心solicit hardware focused papers in the technologies of tomorrow extending from new device to system integration and applications with focus on, but not limited to:

        • 三招改变孩子的粗心Next-generation technology and sensors 三招改变孩子的粗心including devices, integration, and packaging including nano-primitives, non-silicon based technology, and advanced assembly. Sensor interfaces for MEMS, mm-wave/THz, flexible, printed, large-area and organic electronics, electronic-photonic co-design, and silicon photonics.
        • 三招改变孩子的粗心Biomedical circuits, systems, and applications 三招改变孩子的粗心including neural interfaces, microarrays, lab-on-a-chip, bio-inspired circuits, implantable and/or wearable systems, closed-loop systems with sensing and actuation, medical imaging, and other biosensors including biomedical signal processing SoCs, AI/Machine-Learning for mixed-signal/sensing.

        三招改变孩子的粗心Power Management 三招改变孩子的粗心circuits and design techniques including switched-mode integrated converters using inductive, capacitive, and hybrid architectures, energy harvesting circuits, wireless power transfer, power management circuits for automotive applications, linear regulators, control and management circuits, circuit techniques with novel wide-bandgap devices and drivers, and other methods to improve system overall efficiency and performance.

        三招改变孩子的粗心Wireless Transceivers and RF/mm-Wave Circuits and Systems三招改变孩子的粗心 for low-power, energy-efficient and high performance wireless links, biomedical and sensing networks, IoT applications, cellular connectivity including M2M applications (LTE-M, NB-IoT), emerging broadband and MIMO networks (5G, WLAN), vehicle-to-vehicle (V2V), millimeter-wave & THz systems (radar, sensing and imaging), frequency synthesis and LO generation.

        三招改变孩子的粗心Wireline and Optical Communications Circuits and Systems三招改变孩子的粗心 including serial links for intra-chip and chip-to-chip interconnections, high-speed memory and graphics interfaces, backplanes, long-haul, power line communications, high-voltage I/O; novel I/O circuits and signaling methods, clocking techniques including PLLs and CDRs; components such as equalizers, ADC /DAC/ DSP based transceivers, silicon photonics and optical interface circuitry.

        三招改变孩子的粗心Conference Technical Sessions and Events三招改变孩子的粗心

        三招改变孩子的粗心Technical Sessions 三招改变孩子的粗心addressing a broad range of circuits, applications, design techniques, tools, test, reliability, and emerging technologies, and providing education on new, state-of-the-art developments is the core of the CICC technical program.

        三招改变孩子的粗心Industry Sessions (New This Year)三招改变孩子的粗心 highlighting the role of solid-state circuits and SoCs in the creation of novel products.

        三招改变孩子的粗心Educational Sessions 三招改变孩子的粗心instructed by recognized invited speakers who are among the best in the industry are included in the conference. They are valuable opportunities to refresh key skills in traditional circuit-design methods and acquire knowledge in vital new areas in analog, digital, and RF integrated circuit design.

        三招改变孩子的粗心Panels三招改变孩子的粗心, 三招改变孩子的粗心Forums 三招改变孩子的粗心and a 三招改变孩子的粗心Plenary Session 三招改变孩子的粗心provide a platform for leaders from industry and academia to present highlights on new research and development related to circuit design and to debate key issues and controversial topics. CICC panels are well known for their lively and thought-provoking discussion and audience participation.

        Our 三招改变孩子的粗心Welcome Reception三招改变孩子的粗心 and 三招改变孩子的粗心Conference Luncheon三招改变孩子的粗心 provide additional opportunities for discussion and peer networking.

        三招改变孩子的粗心Paper Submission三招改变孩子的粗心

        三招改变孩子的粗心Technical Session Papers三招改变孩子的粗心 are 三招改变孩子的粗心2 pages 三招改变孩子的粗心in length (三招改变孩子的粗心new this year三招改变孩子的粗心). Papers should be camera-ready and submitted electronically in PDF format using the CICC website (www.ieee-cicc.org). 三招改变孩子的粗心Blind review will be adopted this year. Please follow the instructions given at the submission website to submit a blind version for review and a complete version for publication.三招改变孩子的粗心 Appropriate company and government clearances MUST be obtained prior to submission. Papers must report an 三招改变孩子的粗心original unpublished work 三招改变孩子的粗心and concisely explain how the state-of-the-art is advanced, including results. Circuit-design papers must include measured experimental results that substantiate performance claims.

        三招改变孩子的粗心Deadline for paper submission is 11:59 pm Pacific Time on November 3, 2020.三招改变孩子的粗心 Authors of accepted papers will be notified by email by 三招改变孩子的粗心January 10, 2021三招改变孩子的粗心. Top-rated papers will be invited to a special issue at 三招改变孩子的粗心IEEE Journal of Solid State Circuits三招改变孩子的粗心.

        三招改变孩子的粗心Industry Session Papers三招改变孩子的粗心 can range from a single paragraph abstract to 1 page with a maximum of 2 figures. These are non-blind submissions.三招改变孩子的粗心 Deadline for paper submission is 11:59 pm Pacific Time on December 11, 2020.三招改变孩子的粗心 Authors of accepted papers will be notified by email by 三招改变孩子的粗心January 10, 2021三招改变孩子的粗心.

        三招改变孩子的粗心For more information, please visit 三招改变孩子的粗心三招改变孩子的粗心www.ieee-cicc.org三招改变孩子的粗心三招改变孩子的粗心.三招改变孩子的粗心

        三招改变孩子的粗心General Chair三招改变孩子的粗心
        Foster Dai, Auburn University: fosterdai@auburn.edu

        三招改变孩子的粗心Conference Chair三招改变孩子的粗心
        Christophe Antoine, Analog Devices: Christophe.Antoine@analog.com

        三招改变孩子的粗心Technical Program Chairs三招改变孩子的粗心
        Samuel Palermo, Texas A&M University: spalermo@tamu.edu

        Arijit Raychowdhury, Georgia Tech: arijit.raychowdhury@ece.gatech.edu